A Thermo-Viscoelastic Model for the Modulus of Epoxy during Cure

A Thermo-Viscoelastic Model for the Modulus of Epoxy during Cure

Author(s):

Simon, S. L. ( University of Pittsburgh )
Sindt, O. ( NIST )
McKenna, G. B.

Publication title:

ANTEC '99 Conference proceedings, New York City, May 2-6, 1999 : plastics bridging the millennia

Title of ser.:

Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers

Ser. no.:

45(1)

Pub. Year:

1999

Vol.:

1

Page(from):

966

Page(to):

970

Pages:

5

Pub. info.:

Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)

ISBN:

9781566768047 [1566768047]

Language:

English

Call no.:

S42700/45-1

Type:

Conference Proceedings

Details

TDL ID:	ZA00019690
Series ID:	PA00000030
Conf. info. (Name):	ANTEC '99 : Annual Technical Conference
Conf. info. (Number):	57th
Conf. info. (Venue):	New York City, NY, USA
Conf. info. (Date):	1999.05.02-1999.05.06
Note for article:	THERMOSET DIVISION

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