Determining Etch Compensation Factors for Printed Circuit Boards

Determining Etch Compensation Factors for Printed Circuit Boards

Author(s):

DeRose, A. ( University of Wisconsin-Madison )
Theriault, R. P. ( The Ohio State University )
Osswald, T. A.
Castro, J. M.

Publication title:

ANTEC '99 Conference proceedings, New York City, May 2-6, 1999 : plastics bridging the millennia

Title of ser.:

Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers

Ser. no.:

45(1)

Pub. Year:

1999

Vol.:

1

Page(from):

906

Page(to):

910

Pages:

5

Pub. info.:

Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)

ISBN:

9781566768047 [1566768047]

Language:

English

Call no.:

S42700/45-1

Type:

Conference Proceedings

Details

TDL ID:	ZA00019690
Series ID:	PA00000030
Conf. info. (Name):	ANTEC '99 : Annual Technical Conference
Conf. info. (Number):	57th
Conf. info. (Venue):	New York City, NY, USA
Conf. info. (Date):	1999.05.02-1999.05.06
Note for article:	THERMOSET DIVISION

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