Blank Cover Image

UV curable solder resists for printed circuit boards

Author(s):
Fisher, L. J. ( The Dexter Corp., Hysol Div. )  
Publication title:
Technical Papers : Plastics - Meeting Challenges of the Future : ANTEC '82, Annual Technical Conference and Exhibition of the Society of Plastics Engineers, 40, San Francisco Hilton,1982.5.10-13
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
28
Pub. Year:
1982
Page(from):
759
Page(to):
761
Pages:
3
Pub. info.:
Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)
Language:
English
Call no.:
S42700/850141
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings The Corrosive Effect of Soldering Fluxes on Printed Circuit Boards

Galvan, J.C., Bastidas, J.M., Felliu, S.

Electrochemical Society
7 Conference Proceedings Thermal Analysis of Printed Circuit Boards for Infrared Reflow Soldering

Uchida,Hiroki, Sakuyama,Seiki, Natori,Katsuhide, Kawarada,Motonobu, Akai,Reijiro

SPIE - The International Society for Optical Engineering, IMAPS
2 Conference Proceedings Optical measurement of solder bonds on printed circuit boards

J.D. Pearson, F. Lilley, J.T. Atkinson, D.R. Burton, A.J. Goodall

Society of Photo-optical Instrumentation Engineers
8 Conference Proceedings Parallel optical interconnects in printed circuit boards [5990A-14]

Offein, B. J., Berger, C., Beyeler, R., Dangel, R., Dellmann, L., Horst, F., Lamprecht, T., Meier, N., Budd, R., Libsch, …

SPIE - The International Society of Optical Engineering
3 Conference Proceedings Recovery of Solder and Electronic Components from Printed Circuit Boards

Gibson, R.W., Fray, D.J., Sunderland, J.G., Dalrymple, I.M.

Electrochemical Society
9 Conference Proceedings ELECTRODEPOSITED RESISTS FOR IMAGING PRINTED WIRING BOARDS

Bare, John P., Hamilton, William L.

American Institute of Chemical Engineers
4 Conference Proceedings PREDICTIVE DESIGN OF MULTICOMPONENT POLYMERS FOR PRINTED CIRCUIT BOARDS

Beuhler, A.J., Wrezel, J.A., Maas, J.L., Sundahl, Jr. R.C.

Materials Research Society
10 Conference Proceedings AC IMPEDANCE ANALYSIS OF RESIDUES ON PRINTED CIRCUIT BOARDS

White, J.R.

Electrochemical Society
5 Conference Proceedings Investigation of electromigration on printed circuit boards soldered with lead-free solder [6347-67]

Kietbasinski, K., Kalenik, J., Kisiel, R.

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Laser processing system for microdrilling of printed circuit boards

Nishimae,J., Satoh,Y., Kojima,T., Fukushima,T.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings Development of PMP system for high-speed measurement of solder paste volume on printed circuit boards

Jeong,K.M., Kim,J.S., Koh,K.C., Cho,H.S.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Determining Etch Compensation Factors for Printed Circuit Boards

DeRose, A., Theriault, R. P., Osswald, T. A., Castro, J. M.

Society of Plastics Engineers, Inc. (SPE)
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12