Optical pressure sensor head fabrication using ultrathin silicon wafer anodic bonding

Optical pressure sensor head fabrication using ultrathin silicon wafer anodic bonding

Author(s):

Beggans,M.H. ( New Jersey Institute of Technology )
Ivanov,D.I.
Fu,S.G.
Digges,T.G.,Jr.
Farmer,V.K.R.

Publication title:

Design, test, and microfabrication of MEMS and MOEMS : 30 March-1 April 1999, Paris, France

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3680

Pub. Year:

1999

Vol.:

Part2

Page(from):

773

Page(to):

782

Pub. info.:

Bellingham, Wash., USA: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819431547 [0819431540]

Language:

English

Call no.:

P63600/3680

Type:

Conference Proceedings

Details

TDL ID:	ZA00019464
Series ID:	PA00000029
Conf. info. (Name):	Design, test, and microfabrication of MEMS and MOEMS
Conf. info. (Number):	1999
Conf. info. (Venue):	Paris, France
Conf. info. (Date):	1999.03.30-1999.04.01

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