Reliability in Large Area Solder Joint Assemblies and Effects of Thermal Expansion Mismatch and Die Size

Reliability in Large Area Solder Joint Assemblies and Effects of Thermal Expansion Mismatch and Die Size

Author(s):

He,Jun ( Rockwell Science Center )
Morris,W.L.
Shaw,M.C.
Sridhar,N.
Mather,J.C.

Publication title:

Microelectronics : 1-4 November 1998, San Diego Convention Center, San Diego, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3582

Pub. Year:

1998

Page(from):

583

Page(to):

590

Pub. info.:

Bellingham, Wash. — Reston, VA: SPIE - The International Society for Optical Engineering — IMAPS

ISSN:

0277786X

ISBN:

9780930815523 [0930815521]

Language:

English

Call no.:

P63600/3582

Type:

Conference Proceedings

Details

TDL ID:	ZA00019455
Series ID:	PA00000029
Conf. info. (Name):	International symposium on microelectronics
Conf. info. (Number):	1998
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	1998.11.01-1998.11.04

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