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FRACTURE TOUGHNESS OF SILICON AND THIN FILM MICRO-STRUCTURES BY WEDGE INDENTATION

Author(s):
Publication title:
Thin films : stresses and mechanical properties IV : symposium held April 12-16, 1993, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
308
Pub. Year:
1993
Page(from):
647
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992047 [1558992049]
Language:
English
Call no.:
M23500/308
Type:
Conference Proceedings

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