FRACTURE TOUGHNESS OF SILICON AND THIN FILM MICRO-STRUCTURES BY WEDGE INDENTATION

FRACTURE TOUGHNESS OF SILICON AND THIN FILM MICRO-STRUCTURES BY WEDGE INDENTATION

Author(s):

Publication title:

Thin films : stresses and mechanical properties IV : symposium held April 12-16, 1993, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

308

Pub. Year:

1993

Page(from):

647

Pub. info.:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558992047 [1558992049]

Language:

English

Call no.:

M23500/308

Type:

Conference Proceedings

Details

TDL ID:	ZA00019387
Series ID:	PA00000011
Conf. info. (Name):	Symposium on thin films: stresses and mechanical properties
Conf. info. (Number):	4th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1993.04.12-1993.04.16

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