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In Situ Electromigration Damage of Al Interconnect Lines and the Influence of Grain Orientation

Author(s):
Buerke, A.
Wendrock, H.
Kotter, T.
Menzel, S.
Wetzig, K.
Glasow, A. von
1 more
Publication title:
Materials reliability in microelectronics IX : symposium held April 6-8, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
563
Pub. Year:
1999
Page(from):
109
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994706 [155899470X]
Language:
English
Call no.:
M23500/563
Type:
Conference Proceedings

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