Effect of Humidity on Charge Profiles and Thermal Properties of 1.7 ｦﾌm Polyimide Films on Silicon Substrates

Effect of Humidity on Charge Profiles and Thermal Properties of 1.7 ｦﾌm Polyimide Films on Silicon Substrates

Author(s):

Publication title:

Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

515

Pub. Year:

1998

Page(from):

251

Pub. info.:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994218 [1558994211]

Language:

English

Call no.:

M23500/515

Type:

Conference Proceedings

Details

TDL ID:	ZA00019381
Series ID:	PA00000011
Conf. info. (Name):	Symposium on electronic packaging materials science
Conf. info. (Number):	10th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1998.04.14-1998.04.16

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