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Maskless, Direct Deposition of Copper onto Aluminum Bond Pads for Flip-Chip Applications

Author(s):
Fang, M.
O'Keefe, T.
Stroder, M.
Shih, W.
O'Keefe, M.
Strawser, R.
Via, D.
2 more
Publication title:
Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
515
Pub. Year:
1998
Page(from):
85
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994218 [1558994211]
Language:
English
Call no.:
M23500/515
Type:
Conference Proceedings

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