Failure in Tungsten-Filled Via Structures
- Author(s):
- Publication title:
- Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 391
- Pub. Year:
- 1995
- Page(from):
- 423
- Pub. info.:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558992948 [1558992944]
- Language:
- English
- Call no.:
- M23500/391
- Type:
- Conference Proceedings
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