Blank Cover Image

The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines

Author(s):
Publication title:
Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
391
Pub. Year:
1995
Page(from):
197
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992948 [1558992944]
Language:
English
Call no.:
M23500/391
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Electromigration Failure Distributions for Multi-Layer Interconnects as a Function of Line Width: Experiments and Simulation

Brown, D. D., Sanchez, J. E., Jr., Pham, V., Besser, P. R., Korhonen, M. A., Li, C.-Y.

MRS - Materials Research Society
7 Conference Proceedings STRESS-VOIDING AND ELECTROMIGRATION IN MULTILEVEL INTERCONNECT METALLIZATIONS

Korhonen, M. A., Brown, D. D., Li, C. -Y., Rathore, H. S.

MRS - Materials Research Society
2 Conference Proceedings THE EFFECT OF THERMALLY INDUCED STRESSES ON ELECTROMIGRATION LIFETIME OF NEAR-BAMBOO INTERCONNECTS

Korhonen, M. A., Borgesen, P., Brown, D. D., Li, Che-Yu

MRS - Materials Research Society
8 Conference Proceedings ELECTROMIGRATION DAMAGE BY CURRENT INDUCED COALESCENCE OF THERMAL STRESS VOIDS

Borgesen, P., Korhonen, M. A., Sullivan, T. D., Brown, D. D., Li, C. -Y.

Materials Research Society
3 Conference Proceedings MICROSTRUCTURE BASED MODELLING OF STRESS MIGRATION AND ELECTROMIGRATION INDUCED FAILURE DISTRIBUTIONS

Borgesen, P., Korhonen, M. A., Brown, D. D., Li. C. -Y.

MRS - Materials Research Society
9 Conference Proceedings THERMAL STRESS INDUCED VOID FORMATION IN NARROW PASSIVATED Cu LINES

Brown, D. D., Borgesen, P., Lilienfeld, D. A., Korhonen, M. A., Li, C. -Y.

Materials Research Society
4 Conference Proceedings MICROSTRUCTURE BASED MODELLING OF STRESS MIGRATION AND ELECTROMIGRATION INDUCED FAILURE DISTRIBUTIONS

Borgesen, P., Korhonen, M. A., Brown, D. D., Li, C. -Y.

MRS - Materials Research Society
10 Conference Proceedings PREDICTION AND PREVENTION OF STRESS MIGRATION AND ELECTROMIGRATION DAMAGE IN PASSIVATED LINES

Borgesen, P., Korhonen, M. A.,, Li, C.-Y.

Materials Research Society
5 Conference Proceedings EFFECT OF Cu AND Si IN ALUMINUM ON STRESS CHANGE AND ON TiAl3 FORMATION IN Al ALLOY/Ti BILAYER FILMS DURING ANNEALING

Brown, Dirk D., Besser, Paul R., Sanchez, John E., Jr., Korhonen, Matt A., Li, Che-Yu

MRS - Materials Research Society
11 Conference Proceedings Stress-Voiding and Electromigration in Multilevel Interconnects

Korhonen, M. A., Liu, Tao, Brown, D. D., Li, C.-Y.

MRS - Materials Research Society
6 Conference Proceedings EFFECT OF MECHANICAL STRESS ON ELECTROMIGRATION FAILURE MODE DURING ACCELERATED ELECTROMIGRATION TESTS

Pramanick, S., Brown, D. D., Pham, V,, Besser, P., Sanchez, J., Bui, N., Hijab, R., Yue, J. T.

MRS - Materials Research Society
12 Conference Proceedings ANALYSIS OF THERMAL STRESS INDUCED VOID GROWTH DURING THERMAL CYCLING

Brown, D. D., Korhonen, M. A., Borgesen, P., Li, C. -Y.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12