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Temperature and current density distributions in via structures with inhomogenous step coverages

Author(s):
Publication title:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2635
Pub. Year:
1995
Page(from):
145
Page(to):
155
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819420015 [0819420018]
Language:
English
Call no.:
P63600/2635
Type:
Conference Proceedings

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