Failure modes in microelectronic packages
- Author(s):
- Shi,X.Q. ( Gintic Institute of Manufacturing Technology (Singapore) )
- Zhou,W. ( Nanyang Technological Univ.(Singapore) )
- Pang,H.L.J. ( Nanyang Technological Univ.(Singapore) )
- Wang,Z.P. ( Gintic Institute of Manufacturing Technology (Singapore) )
- Publication title:
- Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3510
- Pub. Year:
- 1998
- Page(from):
- 211
- Page(to):
- 218
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819429698 [0819429694]
- Language:
- English
- Call no.:
- P63600/3510
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Investigation of interfacial behavior of a Si-epoxy-FR4 structure under thermal testing using moire interferometry
SPIE-The International Society for Optical Engineering |
7
Conference Proceedings
Novel approach to measure the linear birefringence in bulk optical glass sensing heads of current sensors
SPIE-The International Society for Optical Engineering |
2
Conference Proceedings
Reverse-multiplicate method of moire interferometry and application to measure deformation of a microelectronic package
SPIE-The International Society for Optical Engineering |
Society of Plastics Engineers |
3
Conference Proceedings
Synthesis and Characterization of CTA/CA-Based Forward Osmosis Membranes with Hydrophilic Nano-Titanium Dioxide
Trans Tech Publications |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
5
Conference Proceedings
Influences of extinction ratio and bias-angle error of polarizers on the performance of an optical current sensor
SPIE-The International Society for Optical Engineering |
Trans Tech Publications |
SPIE-The International Society for Optical Engineering |
12
Conference Proceedings
Parameter Study of Numerical Simulation for Tensile Properties of Multi-Layer SMATed Alloys
Trans Tech Publications |