Impact of built-in film thickness measurement in CMP process
- Author(s):
- Yano,H. ( Toshiba Corp. )
- Okumura,K.
- Kondo,N.
- Horie,M.
- Publication title:
- In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing : 19-21 May 1999, Edinburgh, Scotland
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3743
- Pub. Year:
- 1999
- Page(from):
- 68
- Page(to):
- 75
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819432230 [0819432237]
- Language:
- English
- Call no.:
- P63600/3743
- Type:
- Conference Proceedings
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