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Wafer scale Integration of micro-optic and optoelectronic elements by polymer UV reaction molding

Author(s):
Publication title:
Optoelectronic integrated circuits and packaging III : 28-29 January 1999, San Jose, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3631
Pub. Year:
1999
Page(from):
244
Page(to):
251
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819431011 [081943101X]
Language:
English
Call no.:
P63600/3631
Type:
Conference Proceedings

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