Packaging for 3D optoelectronic stacked processors
- Author(s):
- Marchand,P.J. ( Univ.of California/San Diego )
- Zheng,X.
- Huang,D.
- Ozguz,V.H.
- Esener,S.C.
- Publication title:
- Optoelectronic integrated circuits and packaging III : 28-29 January 1999, San Jose, California
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3631
- Pub. Year:
- 1999
- Page(from):
- 142
- Page(to):
- 147
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819431011 [081943101X]
- Language:
- English
- Call no.:
- P63600/3631
- Type:
- Conference Proceedings
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