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THERMODEL:a tool for thermal model generation and application for MEMS packages

Author(s):
Publication title:
Design, Test, Integration, and Packaging of MEMS/MOEMS : 9-11 May 2000, Paris, France
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4019
Pub. Year:
2000
Page(from):
39
Page(to):
49
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819436450 [0819436453]
Language:
English
Call no.:
P63600/4019
Type:
Conference Proceedings

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