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MICROSTRUCTURE AND ELECTROMIGRATION PROPERTIES OF SUBMICRON Al(.5%Cu) LINES

Author(s):
Publication title:
Mechanisms of thin film evolution
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
317
Pub. Year:
1994
Page(from):
219
Pub. info.:
Pittsburgh, PA: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992160 [1558992162]
Language:
English
Call no.:
M23500/317
Type:
Conference Proceedings

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