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Thermal Reliability of Pt/Ti/Pt/Au Schottky Contact on InP With a GaInP Schottky Barrier Enhancement Layer

Author(s):
Kuo, H. C.
Lin, C. H.
Moser, B. G.
Hsia, H.
Tang, Z.
Chen, H.
Feng, M.
Stillman, G. E.
3 more
Publication title:
III-V and IV-IV materials and processing challenges for highly integrated microelectronics and optoelectronics : symposium held November 30-December 3, 1998, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
535
Pub. Year:
1999
Page(from):
231
Pub. info.:
Warrendale, PA: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994416 [1558994416]
Language:
English
Call no.:
M23500/535
Type:
Conference Proceedings

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