Blank Cover Image

Copper Metallization Layers on Bismuth-Telluride Substrates: Effectiveness of Cr, Pt, and Ta40Si14N46 Thin Films As Diffusion Barriers

Author(s):
Publication title:
Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
514
Pub. Year:
1998
Page(from):
537
Pub. info.:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994201 [1558994203]
Language:
English
Call no.:
M23500/514
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings AMORPHOUS W-Zr FILMS AS DIFFUSION BARRIERS BETWEEN Al AND Si

So, F.C.T., Zhao, X.-A., Kolawa, E., Tandon, J.L., Zhu, M.F., Nicolet, M.-A.

Materials Research Society
7 Conference Proceedings THIN-FILM ENCAPSULANTS FOR THERMAL PROCESSING OF GaAs

Molarius, J. M., Kolawa, E., Morishita, K., Pan, E. T.-S, Tandon, J. L., Nicolet, M-A.

Materials Research Society
2 Conference Proceedings Stable Pt/Ge/Au ohmic contact to n-GaAs with a Ta-Si-N barrier

Chen, J. S., Kolawa, E., Ruiz, R. P., Nicolet, M-A.

MRS - Materials Research Society
8 Conference Proceedings KINETICS OF NiSi FORMATION BY SOLID STATE DIFFUSION IN Pt/NiCr/Si VIA GROWTH OF AN AMORPHOUS Cr-RICH BARRIER LAYER

Patnaik, B.K., Lee, Ju Hyeon, Adams, D., Rozgonyi, G.A., Parikh, N.R., Swanson, M.L., Salih, A.S.M., Balducci, P.

Materials Research Society
3 Conference Proceedings Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

Bai, G., Wittenbrock, S., Ochoa, V., Villasol, R., Chiang, C., Marieb, T., Gardner, D., Mu, C., Fraser, D., Bohr, M.

MRS - Materials Research Society
9 Conference Proceedings *APPLICATIONS OF AMORPHOUS Ti-P-N DIFFUSION BARRIERS IN SILICON METALLIZATION

Kolawa, E., Halperin, L., Pokela, P., Vu, Quat T., Nieh, C. W.

Materials Research Society
4 Conference Proceedings INTERFACIAL REACTIONS OF Ag THIN FILMS ON (001) GaAs

Chen, J. S., Kolawa, E., Ruiz, R. P., Nicolet, M-A.

Materials Research Society
10 Conference Proceedings Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization

Maury, F., Gasqueres, C., Duminica, F.-D., Ossola, F.

Trans Tech Publications
5 Conference Proceedings Development of Thick-Film Thermoelectric Microcoolers Using Electrochemical Deposition

Fleurial, J-P., Borshchevsky, A., Ryan, M. A., Phillips, W. M., Snyder, J. G., Caillat, T., Kolawa, E. A., Herman, J. …

MRS - Materials Research Society
11 Conference Proceedings DRY ETCHING OF Ta-Si-N DIFFUSION BARRIER MATERIAL IN CF4+O2 GAS MIXTURES

McLane, G. F., Casas, L., Reid, J. S., Kolawa, E., Nicolet, M-A.

MRS - Materials Research Society
6 Conference Proceedings EFFECTIVENESS OF NITRIDE DIFFUSION BARRIERS IN A SELF-ENCAPSULATED COPPER-BASED METALLIZATION

Adams, D., Spreitzer, R. L., Russell, S. W., Theodore, N. D., Alford, T. L., Mayer, J. W.

MRS - Materials Research Society
12 Conference Proceedings Fabrication of the Electroless NiMoB Films as a Diffusion Barrier Layer on the Low-k Substrate

M. Yashino, T. Masuda, S. Wakaisuki, J. Sasano, I. Matsuda, Y. Shacham-Diamand, T. Osaka

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12