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Solution Delivery for Copper CVD Using Cu(hfac)2 Reduction

Author(s):
Publication title:
Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
514
Pub. Year:
1998
Page(from):
315
Pub. info.:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994201 [1558994203]
Language:
English
Call no.:
M23500/514
Type:
Conference Proceedings

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