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Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ヲフm Technology

Author(s):
Venkatraman, R.
Jain, A.
Farkas, J.
Mendonca, J.
Hamilton, G.
Capasso, C.
Denning, D.
Simpson, C.
Rogers, B.
Frisa, L.
Ong, T. P.
Herrick, M.
Kaushik, V.
Gregory, R.
Apen, E.
Angyal, M.
Filipiak, S.
Crabtree, P.
Sparks, T.
Anderson, S.
15 more
Publication title:
Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
514
Pub. date:
1998
Page(from):
41
Pub. info.:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994201 [1558994203]
Language:
English
Call no.:
M23500/514
Type:
Conference Proceedings

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