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Enhancement of Adhesion Between Cu Thin Film and Polyimide Modified by Ion Assisted Reaction

Author(s):
Publication title:
Atomistic mechanisms in beam synthesis and irradiation of materials : symposium held December 1-2, 1997, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
504
Pub. date:
1999
Page(from):
437
Pub. info.:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994096 [1558994092]
Language:
English
Call no.:
M23500/504
Type:
Conference Proceedings

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