Adhesion Strength of CuCr Alloy Films to Polyimide

Adhesion Strength of CuCr Alloy Films to Polyimide

Author(s):

Publication title:

Electronic packaging materials science VIII : symposium held April 17-20, 1995, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

390

Pub. Year:

1995

Page(from):

55

Pub. info.:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558992931 [1558992936]

Language:

English

Call no.:

M23500/390

Type:

Conference Proceedings

Details

TDL ID:	ZA00018906
Series ID:	PA00000011
Conf. info. (Name):	Symposium on electronic packaging materials science
Conf. info. (Number):	8th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1995.04.17-1995.04.20

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