Blank Cover Image

SOG etch-back process induced surface roughness

Author(s):
Chu,P.-T. ( Taiwan Semiconductor Manufacturing Co. )
Chen,S.-F.
Wu,J.-S.
Hung,C.-C.
Lin,T.-H.
Chao,Y.-C.
1 more
Publication title:
Microelectronic Device and Multilevel Interconnection Technology II
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2875
Pub. Year:
1996
Page(from):
285
Page(to):
292
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819422736 [0819422738]
Language:
English
Call no.:
P63600/2875
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Characterization of SOG(spin on glass)fully etch back process for multilevel interconnection technology

Huang,Y.C., Huang,M.H., Chen,S.F., Yu,C.H., Liu,L.M., Lin,M.S.

SPIE-The International Society for Optical Engineering
7 Conference Proceedings High-efficiency electro-optic polymer light modulator based on waveguide-coupled surface plasmon resonance

Chyou, J.-J., Chu, C.-S., Shih, C.-H., Lin, C.-Y., Huang, K.-T., Chen, S.-J., Shu, S.-F.

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Characterization of environmental halogen molecule contamination-induced pad surface corrosion

Chu,P.-T., Cho,C.W., Hsiao,H.C., Wu,J.S., Hung,C.C., Chao,Y.C

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Local defect real-time monitor system in lithography

Chen,H.-C., Lin,T.-Y., Chu,Y.-C., Hung,C.-C.

SPIE - The International Society for Optical Engineering
3 Conference Proceedings Particle contamination within the tungsten etch back chamber

Chu,P.-T., Chang,K.-H., Peng,T.-M., Chang,C.-H., Yen,S.-W., Lin,T.-H., Chang,C.-R.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings An Improved and Manufacturable Process for Fabricating High Robust MOSFETs with Self-Aligned T-Shaped Gate and Air Spacers (STAIR)

Lin, H.-C., Wang, M.-F., Lin, R., Wu, W.-F., Chiou, C.-C., Chao, T.-S., Huang, T.-Y.

Electrochemical Society
4 Conference Proceedings Novel method to eliminate SOG-etching-back-induced random particle

Hsu,C.F., Chang,C.H., Yu,M.K., Peng,Y.S.

SPIE-The International Society for Optical Engineering
10 Conference Proceedings Parameters study to improve sidewall roughness in advanced silicon etch process

Liu, H.-C., Lin, Y.-H., Chou, B.C.S., Hsu, Y.-Y., Hsu, W.

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Thermal Characterization of Flip-Chip BGA

Chen,H.N., Wu,C.T., Lin,P.J., Hung,S.C.

IMAPS
11 Conference Proceedings THE MICROSCOPIC STUDY OF Y-Ba-Cu-O COMPOUND

Lin, W. T., Chu, H. C., Chen, B. H., Chang, Y. H., Chin, T. S., Wu, P. T.

Materials Research Society
6 Conference Proceedings Metal etch process defects

Lu,T.-Y., Hwang,Y.-K., Lai,C.-H., Chen,S.-F., Chen,C.-H.

SPIE - The International Society for Optical Engineering
12 Conference Proceedings Mix-and-match lithography processes for 0.1-ｦﾌm MOS transistor device fabrication

Yew,J.-Y., Chen,L.-J., Nakamura,K., Chao,T.-S., Lin,H.-C.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12