MODELING AND ELECTRICAL ANALYSIS OF SEAMLESS HIGH OFF-CHIP CONNECTIVITY(SHOCC)INTERCONNECTS
- Author(s):
Schaper,Leonard ( University of Arkansas ) Alfonso,S. Parkerson,J.P Brown,W.D. Ang,S.S. Naseem,H.A. - Publication title:
- 1999 International Conference on High Density Packaging and MCMs : 6-9 April 1999, The Adam's Mark Hotel, Denver, Colorado
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3830
- Pub. Year:
- 1999
- Page(from):
- 327
- Page(to):
- 331
- Pub. info.:
- Reston, VA: IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815578 [0930815572]
- Language:
- English
- Call no.:
- P63600/3830
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
IMAPS |
2
Conference Proceedings
A Highly Adhesive Gold-Based Metallization System for CVD Diamond Substrates
Electrochemical Society |
Materials Research Society |
Materials Research Society |
Society of Photo-optical Instrumentation Engineers |
4
Conference Proceedings
DEPOSITION OF FLUORINATED SILICON NITRIDE USING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION TECHNIQUE
Materials Research Society |
National Aeronautics and Space Adminstration |
Electrochemical Society |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |