LARGE AREA LTCC SUBSTRATE AND HIGH DENSITY OFF-MODULE INTERCONNECT DEVELOPMENTS

LARGE AREA LTCC SUBSTRATE AND HIGH DENSITY OFF-MODULE INTERCONNECT DEVELOPMENTS

Author(s):

Palmer,Edward G. ( Harris Corporation )
Newton,C.Michael

Publication title:

1999 International Conference on High Density Packaging and MCMs : 6-9 April 1999, The Adam's Mark Hotel, Denver, Colorado

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3830

Pub. Year:

1999

Page(from):

289

Page(to):

294

Pub. info.:

Reston, VA: IMAPS

ISSN:

0277786X

ISBN:

9780930815578 [0930815572]

Language:

English

Call no.:

P63600/3830

Type:

Conference Proceedings

Details

TDL ID:	ZA00018555
Series ID:	PA00000029
Conf. info. (Name):	International Conference on High Density Packaging and MCMs
Conf. info. (Number):	1999
Conf. info. (Venue):	Denver, Colorado, USA
Conf. info. (Date):	1999.04.06-1999.04.09

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