7 NEW CAD STRATECIES FOR IC/PACKAGE CO-DESIGN
- Author(s):
- Nguyen,Linh M. ( Tanner Research,Inc. )
- Maher,M.A.
- Publication title:
- 1999 International Conference on High Density Packaging and MCMs : 6-9 April 1999, The Adam's Mark Hotel, Denver, Colorado
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3830
- Pub. Year:
- 1999
- Page(from):
- 137
- Page(to):
- 141
- Pub. info.:
- Reston, VA: IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815578 [0930815572]
- Language:
- English
- Call no.:
- P63600/3830
- Type:
- Conference Proceedings
Similar Items:
SPIE - The International Society for Optical Engineering |
Kluwer Academic Publishers |
SPIE - The International Society for Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
SPIE-The International Society for Optical Engineering |
9
Conference Proceedings
New approach to global alignment in IC manufacturing based on a neural network model
SPIE-The International Society for Optical Engineering |
4
Conference Proceedings
Advanced optical system simulation in a coupled CAD/optical analysis package
SPIE - The International Society for Optical Engineering |
American Institute of Chemical Engineers |
SPIE-The International Society for Optical Engineering |
American Institute of Chemical Engineers |
IMAPS, SPIE-The International Society for Optical |
SPIE - The International Society of Optical Engineering |