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Two-layer resist etchback planarization process coupled to chemical mechanical polishing for sub-0.18-ｦﾌm shallow trench isolation technology

Author(s):
Publication title:
Emerging lithographic technologies III : 15-17 March 1999, Santa Clara, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3676
Pub. Year:
1999
Vol.:
Part2
Page(from):
802
Page(to):
811
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819431509 [0819431508]
Language:
English
Call no.:
P63600/3676
Type:
Conference Proceedings

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