Effects of alignment accuracy on CMP process for overlay control

Effects of alignment accuracy on CMP process for overlay control

Author(s):

Hong,J. ( Hyundai Electronics Industries Co.Ltd. )

Publication title:

Metrology, inspection, and process control for microlithography XIV : 28 February - 2 March 2000, San Clara, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3998

Pub. Year:

2000

Page(from):

441

Page(to):

448

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819436160 [081943616X]

Language:

English

Call no.:

P63600/3998

Type:

Conference Proceedings

Details

TDL ID:	ZA00018514
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Metrology, inspection, and process control for microlithography
Conf. info. (Number):	2000 : 14th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2000.02.28-2000.03.02

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