Blank Cover Image

Use of intentional-defect wafers for tool inspection validation

Author(s):
Publication title:
Metrology, inspection, and process control for microlithography XIV : 28 February - 2 March 2000, San Clara, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3998
Pub. Year:
2000
Page(from):
302
Page(to):
307
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819436160 [081943616X]
Language:
English
Call no.:
P63600/3998
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Application of intentional defect arrays for assessing wafer inspection tool capabilities

Warrick, A.L., Engbrecht, A., Jarvis, R.J.

SPIE-The International Society for Optical Engineering
7 Conference Proceedings Automatic inspection tool sensitivity with characterization of AAPSM defects

Taylor, D., Poortinga, E., Reese, B.W., Gibson, B.C.

SPIE-The International Society for Optical Engineering
2 Conference Proceedings Using optical pattern filtering defect inspection tools and process-induced defects per wafer pass for process defect control

Alvis,J.R., Satterfield,M.J., Gabella,P.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Product and tool control using integrated auto-macro defect inspection in the photolithography cluster [6152-65]

Menon, V. C., Isaacson, R. L., Nicholls, M. C., Lickteig, S. J., Forstner, T., Barnett, A. R., Mulhall, J.

SPIE - The International Society of Optical Engineering
3 Conference Proceedings Novel method of under-etch defect detection for contact layers based on Si substrate using optic wafer inspection tools

B. Lee, J. Choi, S. Chin, D. Cho, C. Song

SPIE - The International Society of Optical Engineering
9 Conference Proceedings A novel approach: high resolution inspection with wafer plane defect detection

C. Hess, M. Wihl, R. Shi, Y. Xiong, S. Pang

Society of Photo-optical Instrumentation Engineers
4 Conference Proceedings Size matters:defect detectability in reticle and wafer inspection including advanced aerial image simulation for defect printability

Almog,E., Caldwell,R.F., Chang,F.-C., Chen,J.F., Farrar,N.R., Karklin,L., Laidig,T.L., Sabouri,S., Shen,W.P., Staud,W., …

SPIE - The International Society for Optical Engineering
10 Conference Proceedings High resolution inspection with wafer plane die: database defect detection

C. Hess, M. Wihl, R. Shi, Y. Xiong, S. Pang

Society of Photo-optical Instrumentation Engineers
5 Conference Proceedings Semiconductor wafer defect detection using digital holography

Schulze, M.A., Hunt, M.A., Voelkl, E., Hickson, J.D., Usry, W.R., Smith, R.G., Bryant, R., Thomas, C.E., Jr.

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Qualification of alternating PSM: defect inspection analysis in comparison to wafer printing results

Dettmann, W., Heumann, J.P., Hagner, T., Koehle, R., Rahn, S., Verbeek, M., Zarrabian, M., Weckesser, J., Hennig, M., …

SPIE-The International Society for Optical Engineering
6 Conference Proceedings A Hierarchical Self-Organizing Neural Network for Automatic Wafer Defect Inspection

Chang, C.Y., Chang, C.W.

Trans Tech Publications
12 Conference Proceedings Reticle inspection optimization for 90-nm and 130-nm technology nodes using a multibeam UV wavelength inspection tool

Lai, R., Hsu, L., Kung, C.H., Hung, J., Huang, W.H., Yoo, C.-S., Huang, Y.-T., Hsu, V.

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12