Blank Cover Image

Design and analysis of across-chip linewidth variation for printed features at 130 nm and below

Author(s):
Chen,J.F. ( ASML MaskTools,Inc. )
Socha,R.J.
Puntambekar,K.
Wampler,K.E.
Caldwell,R.F.
Dusa,M.V.
Love,J.C.
Yeric,G.
Stoner,B.
4 more
Publication title:
Metrology, inspection, and process control for microlithography XIV : 28 February - 2 March 2000, San Clara, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3998
Pub. Year:
2000
Page(from):
168
Page(to):
177
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819436160 [081943616X]
Language:
English
Call no.:
P63600/3998
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Forbidden pitches for 130-nm lithography and below

Socha,R.J., Dusa,M.V., Capodieci,L., Finders,J., Chen,J.F., Flagello,D.G., Cummings,K.D.

SPIE - The International Society for Optical Engineering
7 Conference Proceedings KrF lithography for 130 nm

Finders,J., Schoot,J.B.van, Vanoppen,P., Dusa,M.V., Socha,R.J., Vandenberghe,G., Ronse,K.

SPIE - The International Society for Optical Engineering
2 Conference Proceedings Design of 200-nm,170-nm,and 140-nm DUV contact sweeper high-transmission attenuating phase-shift mask:?.Experimental results

Socha,R.J., Shi,X., Holman,K.C., Dusa,M.V., Conley,W., Petersen,J.S., Chen,J.F., Laidig,T.L., Wampler,K.E., …

SPIE - The International Society for Optical Engineering
8 Conference Proceedings Design of 200-nm,170-nm,and 140-nm DUV contact sweeper high-transmission attenuating phase-shift mask through simulation:I

Socha,R.J., Petersen,J.S., Chen,J.F., Laidig,T.L., Wampler,K.E., Caldwell,R.F.

SPIE - The International Society for Optical Engineering
3 Conference Proceedings Dipole decomposition mask design for full-chip implementation at 100-nm technology node and beyond

Hsu, S.D., Corcoran, N.P., Eurlings, M., Knose, W.T., Laidig, T.L., Wampler, K.E., Roy, S., Shi, X., Hsu, C.M., Chen, …

SPIE-The International Society for Optical Engineering
9 Conference Proceedings Designing dual-trench alternating phase-shift masks for 140-nm and smaller features using 248-nm KrF and 193-nm ArF lithography

Petersen,J.S., Socha,R.J., Naderi,A.R., Baker,C.A., Rizvi,S.A., BanDenBroeke,D., Kachwala,N., Chen,F., Laiding,S., …

SPIE-The International Society for Optical Engineering
4 Conference Proceedings CD error sensitivity to "sub-killer" defects at k1 near 0.4:II

Nakagawa,K.H., Chen,J.F., Socha,R.J., Dusa,M.V., Laidig,T.L., Wampler,K.E., Caldwell,R.F., Broeke,D.J.van den

SPIE - The International Society for Optical Engineering
10 Conference Proceedings 65-nm full-chip implementation using double dipole lithography

Hsu, S.D., Chen, J.F., Cororan, N., Knose, W.T., Broeke, D.J.V.D., Laidig, T.L., Wampler, K.E., Shi, X., Hsu, C.M., …

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Comparison of OPC rules and common process windows for 130-nm features using binary and attenuated phase-shift masks

Reilly,M.T., Parker,C., Kvam,K., Socha,R.J., Dusa,M.V.

SPIE - The International Society for Optical Engineering
11 Conference Proceedings Practical method for full-chip optical proximity correction

Chen,J.F., Laidig,T., Wampler,K.E., Caldwell,R.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings Application of CPL with Interference Mapping Lithography to generate random contact reticle designs for the 65-nm node

Van Den Broeke, D.J., Laidig, T.L., Chen, J.F., Wampler, K.E., Hsu, S.D., Shi, X., Socha, R.J., Dusa, M.V., Corcoran, …

SPIE - The International Society of Optical Engineering
12 Conference Proceedings Understanding the forbidden pitch phenomenon and assist feature placement

Shi, X., Hsu, S., Chen, J.F., Hsu, M., Socha, R.J., Dusa, M.V.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12