Blank Cover Image

Low k Film Etch in Applied Materials eMxP+ Chamber

Author(s):
Publication title:
Plasma deposition and treatment of polymers : symposium held November 30-December 2, 1998, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
544
Pub. Year:
1999
Page(from):
203
Pub. info.:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994508 [1558994505]
Language:
English
Call no.:
M23500/544
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Measurement of Device Charging Damage in a Dielectric Etch 300 mm Chamber with a Bias Voltage Diagnostic Cathode

Doan, K., Shan, H.

Electrochemical Society
7 Conference Proceedings Investigation of Cr etch chamber seasoning

Nesladek, P., Ruhl, G. G., Kristlib, M.

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Particle contamination within the tungsten etch back chamber

Chu,P.-T., Chang,K.-H., Peng,T.-M., Chang,C.-H., Yen,S.-W., Lin,T.-H., Chang,C.-R.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Fabrication of YSZ Thin-Film for SOFC Applied by Electron Beam PVD

Shin, T.H., Yu, J.H., Lee, S., Han, l.S., Seo, D.W., Hong, K.S., Woo, S.K., Hyun, S.H.

Trans Tech Publications
3 Conference Proceedings CHEMICAL FORMULATIONS FOR STRIPPING POST-ETCH PHOTORESIST ON A LOW-к FILM IN SUPERCRITICAL CARBON DIOXIDE

M. B. Korzenski, T. H. Baum, K. Saga, H. Kuniyasu, T. Hattori

Electrochemical Society
9 Conference Proceedings Film Properties of Low-Density and Ultra-Low-Dielectric-Constant Material

Arao, H., Egami, M., Komatsu, M., Muraguchi, R., Nakashima, A., Tounai, A.

Materials Research Society
4 Conference Proceedings Advanced Process Control in Semiconductor Manufacturing; Applied Materials' implementation for a Dep-Etch Module

Ilias Iliopoulos, A. Schwarm, K.S. Jun, M. Armacost

American Institute of Chemical Engineers
10 Conference Proceedings CORRELATION BETWEEN PROCESSING, COMPOSITION, AND MECHANICAL PROPERTIES OF PECVD-SiNx THIN FILMS

Yu, D. C. H., Taylor, J. A.

Materials Research Society
5 Conference Proceedings The effects of etch chemistry on the etch rates of ArF BARC prodcts [6153-23]

Zhuang, H, Abdallah, D, Xiang, Z, Wu, H, Shan, J, Lu, P H, Neisser M, Karwacki, E J, Ji, B, Badowski, P R

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Chamber Simulations of Cloud Chemistry: The AIDA Chamber

R. Wangner, H. Bunz, C. Linke, O. Moehler, K. -H. Naumann, H. Saathoff, M. Schnaiter, U. Schurath

Springer
6 Conference Proceedings Low Dielectric Constant Material Deposited by HDPCVD for Barrier and Etch Stop Application in Cu Damascene Structure

Cho, S.-M., Zhang, L., M'saad, H., Zhuang, L.

Electrochemical Society
12 Conference Proceedings Residual Gas Analysis of Periodic Chamber Dry Cleans in the Ar+ Sputter Etch Process

Singh, K.K., Crockett, M., Bhatnagar, Y.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12