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Simulation of the Effect of Dielectric Air Gaps on Interconnect Reliability

Author(s):
Bassman, L. C.
Vinci, R. P.
Shieh, B. P.
Kim, D-K.
McVittie, J. P.
Saraswat, K. C.
Deal, M. D.
2 more
Publication title:
Materials reliability in microelectronics VII : symposium held April 8-12, 1997, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
473
Pub. date:
1997
Page(from):
323
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993778 [1558993770]
Language:
English
Call no.:
M23500/473
Type:
Conference Proceedings

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