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New processing approach for grafting optoelectronic devices and applications to multichip modules

Author(s):
Publication title:
Optoelectronic Interconnects and Packaging IV
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3005
Pub. date:
1997
Page(from):
120
Page(to):
127
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819424167 [0819424161]
Language:
English
Call no.:
P63600/3005
Type:
Conference Proceedings

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