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Optoelectronic backplane interconnect technology development:POINT

Author(s):
Liu,Y.S. ( GE Corporate Research and Development Ctr. )
Hennessy,W.B.
Wojnarowski,R.J.
Bristow,J.P.
Liu,Y.
Rowlette,J.R.
Stack,J.D.
Yardley,J.T.
Eldada,L.A.
Osgood,R.M.,Jr.
Scarmozzino,R.
Lee,S.H.
Patra,S.K.
8 more
Publication title:
Optoelectronic Interconnects and Packaging IV
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3005
Pub. Year:
1997
Page(from):
2
Page(to):
10
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819424167 [0819424161]
Language:
English
Call no.:
P63600/3005
Type:
Conference Proceedings

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