Role of RIE in microchip bond pad corrosion
- Author(s):
Brownson,R. ( Motorola ) Butler,K. Cadena,S. Detar,M. Johnson,I. McCoulloch,L. McCoulloch,J. Mishra,B. Healey,J.T. Honcik,K. Phan,T.T. Sterif,T. Stevens,H. Tovar,A. - Publication title:
- Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 2874
- Pub. Year:
- 1996
- Page(from):
- 95
- Page(to):
- 102
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819422729 [081942272X]
- Language:
- English
- Call no.:
- P63600/2874
- Type:
- Conference Proceedings
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