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Role of RIE in microchip bond pad corrosion

Author(s):
Brownson,R. ( Motorola )
Butler,K.
Cadena,S.
Detar,M.
Johnson,I.
McCoulloch,L.
McCoulloch,J.
Mishra,B.
Healey,J.T.
Honcik,K.
Phan,T.T.
Sterif,T.
Stevens,H.
Tovar,A.
9 more
Publication title:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2874
Pub. Year:
1996
Page(from):
95
Page(to):
102
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819422729 [081942272X]
Language:
English
Call no.:
P63600/2874
Type:
Conference Proceedings

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