Inter-and intra-die polysilicon critical dimension variation

Inter-and intra-die polysilicon critical dimension variation

Author(s):

Stine,B.E. ( Massachusetts Institute of Technology )
Boning,D.S.
Chung,J.E.
Bell,D.A.
Equi,E.

Publication title:

Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2874

Pub. Year:

1996

Page(from):

27

Page(to):

35

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819422729 [081942272X]

Language:

English

Call no.:

P63600/2874

Type:

Conference Proceedings

Details

TDL ID:	ZA00018422
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing : Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
Conf. info. (Number):	1996 : 2nd
Conf. info. (Venue):	Austin, TX, USA
Conf. info. (Date):	1996.10.16-1996.10.17

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