Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects

Texture and Grain Structure Effects on the Reliability of Microelectronic Interconnects

Author(s):

Publication title:

ICOTOM-10 : proceedings of the 10th International Conference on Textures of Materials, Clausthal, Germany, 20-24 September 1993

Title of ser.:

Materials science forum

Ser. no.:

157-162

Pub. Year:

1994

Vol.:

Part2

Page(from):

1435

Page(to):

1442

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878496815 [0878496815]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00018360
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Textures of Materials : ICOTOM
Conf. info. (Number):	10th
Conf. info. (Venue):	Clausthal, Germany
Conf. info. (Date):	1993.09.20-1993.09.24

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