Wet and dry etching characteristics of electron beam deposited SiO and SiO2
- Author(s):
LaRoche, J.R. ( University of Florida ) Ren, F. Lothian, J.R. Hong, J. Pearton, S.J. Lambers, E. - Publication title:
- Compound semiconductor surface passivation and novel device processing : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 573
- Pub. Year:
- 1999
- Page(from):
- 259
- Page(to):
- 264
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558994805 [1558994807]
- Language:
- English
- Call no.:
- M23500/573
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
The use of amorphous SiO and SiO2 to passivate AuGe based ohmic contact for GaAs ICs
Electrochemical Society |
Electrochemical Society |
Materials Research Society |
8
Conference Proceedings
Extremely High Etching Rate of In-Based III-V Semiconductors in BCl3/N2 Based Plasma
Electrochemical Society |
Materials Research Society |
MRS - Materials Research Society |
4
Conference Proceedings
Electron Cyclotron Resonance Chemical Vapor Deposited Silicon Nitride for T-gate Passivation
Electrochemical Society |
MRS - Materials Research Society |
5
Conference Proceedings
Novel in-situ ion bombardment process for a thermally stable (>800 C) plasma deposited dielectric
Materials Research Society |
11
Conference Proceedings
GROWTH OF GaN, AIN AND InN BY ELECTRON CYCLOTRON RESONANCE-METAL ORGANIC MOLECULAR BEAM EPITAXY
Materials Research Society |
Electrochemical Society |
MRS - Materials Research Society |