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Improving the Reliability and Performance of Microelectronic Packaging

Author(s):
Weaver, J. ( Texas A&M University )
Gam, K. T. ( Dexter Corporation )
Oh, Y.
Bonnaud, L.
Suh, S.
Sue, H. -J.
Todd, M.
Ji, Q.
Edwards, M.
4 more
Publication title:
ANTEC 2001, conference proceedings, Dallas, Texas, May 6-10
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
47
Pub. Year:
2001
Pt.:
2
Page(from):
1340
Page(to):
1343
Pages:
4
Pub. info.:
Brookfield Center, CT: Society of Plastics Engineers
ISBN:
9781587160981 [1587160986]
Language:
English
Call no.:
S42700/47
Type:
Conference Proceedings

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