Low-cost 320 x 240 uncooled IRFPA using a conventional silicon IC process

Low-cost 320 x 240 uncooled IRFPA using a conventional silicon IC process

Author(s):

Ishikawa,T. ( Mitsubishi Electric Corp. )

Publication title:

Infrared technology and applications XXV : 5-9 April 1999, Orlando, Florida

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3698

Pub. Year:

1999

Page(from):

556

Page(to):

564

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819431721 [0819431729]

Language:

English

Call no.:

P63600/3698

Type:

Conference Proceedings

Details

TDL ID:	ZA00018084
Series ID:	PA00000029
Conf. info. (Name):	Defense, Security, and Sensing : Infrared technology and applications
Conf. info. (Number):	1999 : 25th
Conf. info. (Venue):	Orlando, FL, USA
Conf. info. (Date):	1999.04.05-1999.04.09

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