High-density plasma dry etch for DUV attenuated phase-shifting masks

High-density plasma dry etch for DUV attenuated phase-shifting masks

Author(s):

Peng,S. ( IBM Microelectronics Div. (USA) )
Adir,W.J. ( IBM Microelectronics Div. (USA) )

Publication title:

Photomask and X-Ray Mask Technology V

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3412

Pub. Year:

1998

Page(from):

228

Page(to):

232

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819428646 [0819428647]

Language:

English

Call no.:

P63600/3412

Type:

Conference Proceedings

Details

TDL ID:	ZA00017848
Series ID:	PA00000029
Conf. info. (Name):	Photomask and Next Generation Lithography Mask Technology : Photomask and X-Ray Mask Technology
Conf. info. (Number):	1998 : 5th
Conf. info. (Venue):	Kawasaki, Japan
Conf. info. (Date):	1998.04.09-1998.04.10

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