Development of low-temperature wafer level vacuum packaging for microsensors

Development of low-temperature wafer level vacuum packaging for microsensors

Author(s):

Huang,W.-F. ( National Chiao Tung Univ. )
Shie,J.-S.
Lee,C.
Gong,S.C.
Peng,C.-J.

Publication title:

Design, characterization, and packaging for MEMS and microelectronics : 27-29 October 1999, Royal Pines Resort, Queensland, Australia

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3893

Pub. Year:

1999

Page(from):

478

Page(to):

485

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819434944 [0819434949]

Language:

English

Call no.:

P63600/3893

Type:

Conference Proceedings

Details

TDL ID:	ZA00017634
Series ID:	PA00000029
Conf. info. (Name):	Smart Materials, Nano-, and Micro- Smart Systems : Design, characterization, and packaging for MEMS and microelectronics
Conf. info. (Number):	1999
Conf. info. (Venue):	Royal Pines Resort, Queensland, Australia
Conf. info. (Date):	1999.10.27-1999.10.29

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