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Tool and method for the theremal transient evaluation of packages

Author(s):
Publication title:
Design, characterization, and packaging for MEMS and microelectronics : 27-29 October 1999, Royal Pines Resort, Queensland, Australia
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3893
Pub. Year:
1999
Page(from):
94
Page(to):
103
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819434944 [0819434949]
Language:
English
Call no.:
P63600/3893
Type:
Conference Proceedings

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