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Integrated IMP Ti and MOCVD TiN for 300-mm W barrier and Liner for sub-0.18-ｦﾌm IC processing

Author(s):
Tolia,A. ( Applied Material,Inc )
Menezes,M.
Li,J.
Jackson,M.
Pavate,V.
Khurana,N.
Mosely,R.
Narasimhan,M.K.
Chang,M.
Chen,F.E.
5 more
Publication title:
Multilevel Interconnect Technology III
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3883
Pub. Year:
1999
Page(from):
130
Page(to):
136
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819434807 [0819434809]
Language:
English
Call no.:
P63600/3883
Type:
Conference Proceedings

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