Blank Cover Image

Influence of IMP copper flash layer on the properties of copper films deposited by metal organic chemical vapor deposition

Author(s):
Li,C.Y. ( Institute of Microelectronics )
Zhang,D.H.
Qian,Y.
Narayanan,B.
Wu,J.J.
Yu,B.
Jiang,Z.X.
Foo,P.D.
Xie,J.
Zhang,Q.
Yoon,S.F.
6 more
Publication title:
Multilevel Interconnect Technology III
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3883
Pub. Year:
1999
Page(from):
46
Page(to):
49
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819434807 [0819434809]
Language:
English
Call no.:
P63600/3883
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings IMP copper seed layer formation with TaN barrier for deep submicron

Narayanan,B., Li,C.Y., Lee,K., Yu,B., Wu,J.J., Foo,P.D., Xie,J.

SPIE - The International Society for Optical Engineering
7 Conference Proceedings CVD Cu/IMP Cu/TaN/SiO2/Si structures

Loh,S.W., Zhang,D.H., Li,C.Y., Liu,R., Wee,A.T.S.

SPIE-The International Society for Optical Engineering
2 Conference Proceedings Effects Of A Thin Flash Copper Layer On The Diffusion Of Cu, Ta, Si, And O In The Cu/TaN/SiO2/Si Structures

Loh, S.W., Zhang, D.H., Li, C.Y., Liu, R., Wee, A.T.S., Foo, P.D., Xie, Joseph, Prasad, K., Tan, C.M., Lee, Y.K.

Electrochemical Society
8 Conference Proceedings CHEMICAL VAPOR DEPOSITION OF COPPER FROM METAL-ORGANIC COPPER ( I ) PHOSPHINE COMPLEXES

Shin, H. -K., Hampden-Smith, M. J., Kodas, T. T., Duesler, E.. N., Farr, J. D., Paffett, M.

Materials Research Society
3 Conference Proceedings New Applications of MetaPULSE in Copper Metallization Process

Liu, H., Wang, S.R., He, L., Zhang, Y., Li, W.H., Wu, J.J., Qian, Y., Li, C.Y., Koh, L.T., Liu, Y.J., Xie, J.

Electrochemical Society
9 Conference Proceedings Effects Of Focused Ion Beam On ECP Copper

Zhao, S.P., Koh, L.T., Zhang, D.H., Loh, S.A., Liew, G.M., Li, C.Y., Woo, Y.K., Cheng, C.K., Foo, P.D.

Electrochemical Society
4 Conference Proceedings Post-ECP Annealing For Advanced Copper Interconnect Application

Zhang, Y., Koh, L.T., Li, C.Y., Liu, H., You, G.Z, Wu, J.J., Xie, J.

Electrochemical Society
10 Conference Proceedings JET VAPOR DEPOSITION OF NANOSTRUCTURE COMPOSITE MATERIALS

Zhang, J.-Z., Golz, J.W., Johnson, D.L., McAvoy, D.T., Halpern, B.L., Schmitt, J.J.

Materials Research Society
5 Conference Proceedings Carbon Networks Synthesized using Microwave Plasma Enhanced Chemical Vapor Deposition

Yang, D.J., Zhang, Qing, Yoon, S.F., Ahn, J., Wang, S.G., Wang, Q.

Materials Research Society
11 Conference Proceedings Chemical Vapor Deposition of Copper Films: Influence of the Seeding Layers

Yoon, Kyoung-Ryul, Kim, Seok, Choi, Doo-Jin, Kim, Ki-Hwan, Koh, Seok-Keun

MRS - Materials Research Society
6 Conference Proceedings GROWTH AND CHARACTERIZATION OF EPITAXIAL GaAs DEPOSITED BY PLASMA-ENCHANCED METAL-ORGANIC CHEMICAL VAPOR DEPOSITION

Huelsman, A. D., Yoon, E., Reif, R.

Materials Research Society
12 Conference Proceedings Influences of temperature on the Raman spectra of single-walled carbon nanotubes

Zhang, Q., Yang, D.J., Wang, S.G., Yoon, S.F., Ahn, J.

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12