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IMP copper seed layer formation with TaN barrier for deep submicron

Author(s):
Narayanan,B. ( Institute of Microelectronics )
Li,C.Y.
Lee,K.
Yu,B.
Wu,J.J.
Foo,P.D.
Xie,J.
2 more
Publication title:
Multilevel Interconnect Technology III
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3883
Pub. Year:
1999
Page(from):
42
Page(to):
45
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819434807 [0819434809]
Language:
English
Call no.:
P63600/3883
Type:
Conference Proceedings

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