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Creep Resistant Solders for Packaging in Optical Communication Devices

Author(s):
Publication title:
Reliability of photonics materials and structures : symposium held April 13-16, 1998, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
531
Pub. Year:
1998
Page(from):
83
Pub. info.:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994379 [1558994378]
Language:
English
Call no.:
M23500/531
Type:
Conference Proceedings

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